Enabling Cu wire in 3D stack package
| Title: | Enabling Cu wire in 3D stack package |
|---|---|
| Authors: | Camenforte, Ruby Ann M.; de Asis, Ray Fredric; Chowdhury, Mahmud |
| Source: | 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :512-517 Apr, 2016 |
| Relation: | 2016 International Conference on Electronics Packaging (ICEP) |
| Database: | IEEE Xplore Digital Library |