| Title: |
Small Pitch, High Aspect Ratio Via-Last TSV Module |
| Authors: |
Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric |
| Source: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :43-49 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |