| Title: |
Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad |
| Authors: |
Au, K. Y.; Che, F. X.; Lin, Jong-Kai; Hsiao, Hsiang-Yao; Zhang, Xiaowu; Lim, Sharon; Aw, Jie Li; Chow, Alvin |
| Source: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :936-942 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |