Challenges of Ultra-Thin 5 Sides Molded WLCSP
| Title: | Challenges of Ultra-Thin 5 Sides Molded WLCSP |
|---|---|
| Authors: | Tang, Tom; Lan, Albert; Wu, Jason; Huang, Joe; Tsai, Jensen; Li, Jerry; Ho, Arthur; Chang, Jerry; Lin, Wh |
| Source: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1167-1171 May, 2016 |
| Relation: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |