Thermal challenges for packaging integrated photonic devices
| Title: | Thermal challenges for packaging integrated photonic devices |
|---|---|
| Authors: | Gradkowski, Kamil; Eason, Cormac; Lee, Jun Su; Bernabe, Stephane; Temporiti, Enrico; Carroll, Lee; O'Brien, Peter |
| Source: | 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-5 Sep, 2016 |
| Relation: | 2016 6th Electronic System-Integration Technology Conference (ESTC) |
| Database: | IEEE Xplore Digital Library |