| Title: |
Advanced nano-Ag thermal interface material for high thermal flip chip BGA |
| Authors: |
Yeh, Chi-Tung; Qiu, Wei-Chun; Ji, Jiao-Dong; Pan, Ji-An; Lin, Rong-Zheng; Ng, Gong-Dun; Lin, Chang-Fu; Chung, Key; Hsiao, C. S |
| Source: |
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :366-369 Oct, 2016 |
| Relation: |
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |