| Title: |
Recent advances in low temperature process in view of 3D VLSI integration |
| Authors: |
Fenouillet-Beranger, C.; Batude, P.; Brunet, L.; Mazzocchi, V.; Lu, C-M.V.; Deprat, F.; Micout, J.; Samson, M-P.; Previtali, B.; Besombes, P.; Rambal, N.; Lapras, V.; Andrieu, F.; Billoint, O.; Brocard, M.; Thuries, S.; Cibrario, G.; Acosta-Alba, P.; Mathieu, B.; Kerdiles, S.; Nemouchi, F.; Arvet, C.; Besson, P.; Loup, V.; Gassilloud, R.; Garros, X.; Leroux, C.; Beugin, V.; Guerin, C.; Benoit, D.; Pasini, L.; Hartmann, J-M.; Vinet, M. |
| Source: |
2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2016 IEEE. :1-3 Oct, 2016 |
| Relation: |
2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) |
| Database: |
IEEE Xplore Digital Library |