New effect of Ti-capping layer in Co salicide process promising for deep sub-quarter micron technology
| Title: | New effect of Ti-capping layer in Co salicide process promising for deep sub-quarter micron technology |
|---|---|
| Authors: | Ja-Hum Ku; Chul-Sung Kim; Chul-Joon Choi; Fujihara, K.; Ho-Kyu Kang; Moon-Yong Lee; Ju-Hyuck Chung; Eung-Joon Lee; Jang-Eun Lee; Dae-Hong Ko |
| Source: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :256-258 1999 |
| Relation: | Proceedings of the IEEE 1999 International Interconnect Technology Conference |
| Database: | IEEE Xplore Digital Library |