| Title: |
Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor |
| Authors: |
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S. |
| Source: |
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-5 Apr, 2017 |
| Relation: |
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |