| Title: |
Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal |
| Authors: |
Chew, S-A.; Yu, H.; Schaekers, M.; Demuynck, S.; Mannaert, G.; Kunnen, E.; Rosseel, E.; Hikavyy, A.; Dangol, A.; Meyer, K. De; Mocuta, D.; Horiguchi, N.; Leusink, G.; Wajda, C.; Hakamata, T.; Hasegawa, T.; Tapily, K.; Clark, R. |
| Source: |
2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017 |
| Relation: |
2017 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |