| Title: |
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects |
| Authors: |
De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas |
| Source: |
2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-5 Nov, 2016 |
| Relation: |
2016 IEEE International 3D Systems Integration Conference (3DIC) |
| Database: |
IEEE Xplore Digital Library |