| Title: |
Development of a Multi-project Fan-Out Wafer Level Packaging Platform |
| Authors: |
Braun, T.; Raatz, S.; Maass, U.; Van Dijk, M.; Walter, H.; Holck, O.; Becker, K.-F.; Topper, M.; Aschenbrenner, R.; Wohrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M. |
| Source: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1-7 May, 2017 |
| Relation: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |