| Title: |
Packaging Innovations for High Voltage (HV) GaN Technology |
| Authors: |
Mishra, D.; Arora, V.; Nguyen, L.; Iriguchi, S.; Sada, H.; Clemente, L.; Lim, S.; Lin, HY; Lohia, A.; Gurrum, S.; Sauser, J.; Spencer, S. |
| Source: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1480-1484 May, 2017 |
| Relation: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |