Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC
| Title: | Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC |
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| Authors: | Jani, Imed; Lattard, Didier; Vivet, Pascal; Beigne, Edith |
| Source: | 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS) New Circuits and Systems Conference (NEWCAS), 2017 15th IEEE International. :153-156 Jun, 2017 |
| Relation: | 2017 15th IEEE International New Circuits and Systems Conference (NEWCAS) |
| Database: | IEEE Xplore Digital Library |