Flip-chip on flex for 3D packaging
| Title: | Flip-chip on flex for 3D packaging |
|---|---|
| Authors: | Clot, P.; Zeberli, J.-F.; Chenuz, J.-M.; Ferrando, F.; Styblo, D. |
| Source: | Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT. :36-41 1999 |
| Relation: | Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium |
| Database: | IEEE Xplore Digital Library |