| Title: |
Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data |
| Authors: |
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Johrmann, N.; Pareek, K. A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M. J.; Rzepka, S. |
| Source: |
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-13 Apr, 2018 |
| Relation: |
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |