| Title: |
Fan-out wafer level packaging for 5G and mm-Wave applications |
| Authors: |
Braun, T.; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D. |
| Source: |
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :247-251 Apr, 2018 |
| Relation: |
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
| Database: |
IEEE Xplore Digital Library |