| Title: |
An automated process for inclusion of package dies and circuitry within a textile yarn |
| Authors: |
Hardy, Dorothy; Anastasopoulos, Ioannis; Nashed, M-Nour; Oliveira, Carlos; Hughes-Riley, Theodore; Komolafe, Abiodun; Tudor, John; Torah, Russel; Beeby, Steve; Dias, Tilak |
| Source: |
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-5 May, 2018 |
| Relation: |
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) |
| Database: |
IEEE Xplore Digital Library |