BISTs for post-bond test and electrical analysis of high density 3D interconnect defects
| Title: | BISTs for post-bond test and electrical analysis of high density 3D interconnect defects |
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| Authors: | Jani, Imed; Lattard, Didier; Vivet, Pascal; Arnaud, Lucile; Beigne, Edith |
| Source: | 2018 IEEE 23rd European Test Symposium (ETS) Test Symposium (ETS), 2018 IEEE 23rd European. :1-6 May, 2018 |
| Relation: | 2018 IEEE European Test Symposium (ETS) |
| Database: | IEEE Xplore Digital Library |