| Title: |
Panel Level Packaging - A View Along the Process Chain |
| Authors: |
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Wohrmann, M.; Boettcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D. |
| Source: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :70-78 May, 2018 |
| Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |