Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding
| Title: | Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding |
|---|---|
| Authors: | Cho, Junghyun; Dong, Fei; Yin, Liang; Shaddock, David |
| Source: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :551-556 May, 2018 |
| Relation: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |