| Title: |
Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor |
| Authors: |
Alghoul, Thaer M.; Yadav, Manu; Thekkut, Sanoop; Sivasubramony, Rajesh S.; Greene, Christopher M.; Poliks, Mark D.; Borgesen, Peter; Wentlent, Luke; Meilunas, Michael; Stoffel, Nancy; Shaddock, David M.; Yin, Liang |
| Source: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :948-953 May, 2018 |
| Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |