| Title: |
Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density |
| Authors: |
Boettge, Bianca; Naumann, F.; Behrendt, S.; G. Scheibel, M.; Kaessner, S.; Klengel, S.; Petzold, M.; G. Nickel, K.; Hejtmann, G.; Z. Miric, A.; Eisele, R. |
| Source: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1258-1269 May, 2018 |
| Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |