From Direct Bonding Mechanism to 3D Applications
| Title: | From Direct Bonding Mechanism to 3D Applications |
|---|---|
| Authors: | Fournel, F.; Moriceau, H.; Larrey, V.; Morales, C.; Mauguen, C.; Bridoux, C.; Rieutord, F. |
| Source: | 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :175-178 Jun, 2018 |
| Relation: | 2018 IEEE International Interconnect Technology Conference (IITC) |
| Database: | IEEE Xplore Digital Library |