| Title: |
Interconnect Stack using Self-Aligned Quad and Double Patterning for 10nm High Volume Manufacturing |
| Authors: |
Yeoh, A.; Madhavan, A.; Kybert, N.; Anand, S.; Shin, J.; Asoro, M.; Samarajeewa, S.; Steigerwald, J.; Ganpule, C.; Buehler, M.; Tripathi, A.; Souw, V.; Haran, M.; Nigam, S.; Chikarmane, V.; Yashar, P.; Mule, T.; Wu, Y-H.; Lee, K-S.; Aykol, M.; Marla, K.; Sinha, P.; Kirby, S.; Hiramatsu, H.; Han, W.; Mori, M.; Sharma, M.; Jeedigunta, H.; Sprinkle, M.; Pelto, C.; Tanniru, M.; Leatherman, G.; Fischer, K.; Post, I.; Auth, C. |
| Source: |
2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :144-147 Jun, 2018 |
| Relation: |
2018 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |