| Title: |
Opportunities and Challenges of Resistive RAM for Neuromorphic Applications |
| Authors: |
Degraeve, R.; Mallik, A.; Garbin, D.; Doevenspeck, J.; Fantini, A.; Rodopoulos, D.; Roussel, Ph.; Govoreanu, B.; Hendrickx, P.; Di Piazza, L.; Stuijt, J.; Schaafsma, S.; Debacker, P.; Donadio, G.; Hody, H.; Goux, L.; Kar, G. S.; Furnemont, A.; Mocut, A.; Verkest, D. |
| Source: |
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018 |
| Relation: |
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| Database: |
IEEE Xplore Digital Library |