| Title: |
A Demonstration on the Effectiveness of Wafer-level Thermal Microscopy as A Complementary Tool to Photon Emission Microscopy Using MBIST Failure Debug |
| Authors: |
Yeoh, BL; Goh, SH; Thor, MH; Hao, Hu; Tan, Alan; Chan, YH; Lin, Zhao; Neo, SP; Lam, Jeffrey; Chua, CM; Tan, SH |
| Source: |
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018 |
| Relation: |
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| Database: |
IEEE Xplore Digital Library |