| Title: |
Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology |
| Authors: |
Peng, L.; Kim, S-W; Iacovo, S.; Inoue, F.; Phommahaxay, A.; Sleeckx, E.; De Vos, J.; Miller, A.; Beyer, G.; Beyne, E.; Zinner, D.; Wagenleitner, T.; Uhrmann, T.; Wimplinger, M.; Schoenaers, B.; Stesmans, A.; Afanas'ev, V. V. |
| Source: |
2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :179-181 Jun, 2018 |
| Relation: |
2018 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |