| Title: |
Future Interconnect Materials and System Integration Strategies for Data-Intensive Applications |
| Authors: |
Apte, P.; Salmon, T.; Rice, R.; Gerber, M.; Beica, R.; Calvert, J.; Hemker, D.; Dordi, Y.; Ranjan, M.; Ramalingam, S.; Gandhi, J.; Kaviani, A.; Mitra, S.; Wong, P.; Lee, V.; El-Sabry, M. |
| Source: |
2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-5 Sep, 2018 |
| Relation: |
2018 7th Electronic System-Integration Technology Conference (ESTC) |
| Database: |
IEEE Xplore Digital Library |