| Title: |
Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste |
| Authors: |
Ferrando, F.; Zeberli, J.-F.; Clot, P.; Chenuz, J.-M. |
| Source: |
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Adhesive joining and coating technology in electronics manufacturing Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on. :205-211 2000 |
| Relation: |
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 |
| Database: |
IEEE Xplore Digital Library |