| Title: |
First Demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers |
| Authors: |
Vandooren, A.; Franco, J.; Wu, Z.; Parvais, B.; Li, W.; Witters, L.; Walke, A.; Peng, L.; Deshpande, V.; Rassoul, N.; Hellings, G.; Jamieson, G.; Inoue, F.; Devriendt, K.; Teugels, L.; Heylen, N.; Vecchio, E.; Zheng, T.; Rosseel, E.; Vanherle, W.; Hikavyy, A.; Mannaert, G.; Chan, B. T.; Ritzenthaler, R.; Mitard, J.; Ragnarsson, L.; Waldron, N.; De Heyn, V.; Demuynck, S.; Boemmels, J.; Mocuta, D.; Ryckaert, J.; Collaert, N. |
| Source: |
2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :7.1.1-7.1.4 Dec, 2018 |
| Relation: |
2018 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |