| Title: |
Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF) |
| Authors: |
Pun, Kelvin P. L.; Rotanson, Jason; Dhaka, Navdeep S.; Cheung, Chee-Wah; Chan, Alan H. S. |
| Source: |
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :924-931 Dec, 2018 |
| Relation: |
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |