Exploration of the Impact of Physical Integration Schemes on Soft Errors in 3D ICs Using Monte Carlo Simulation
| Title: | Exploration of the Impact of Physical Integration Schemes on Soft Errors in 3D ICs Using Monte Carlo Simulation |
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| Authors: | Breeding, M. L.; Reed, R. A.; Warren, K. M.; Alles, M. L. |
| Source: | 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-7 Mar, 2019 |
| Relation: | 2019 IEEE International Reliability Physics Symposium (IRPS) |
| Database: | IEEE Xplore Digital Library |