High thermal conductivity composite resin sheet filled with large diameter aluminum nitride and aggregated boron nitride
| Title: | High thermal conductivity composite resin sheet filled with large diameter aluminum nitride and aggregated boron nitride |
|---|---|
| Authors: | Masada, I.; Fujii, S.; Imazumi, S.; Fujinami, K.; Kanechika, Y.; Nawata, T.; Ueda, M. |
| Source: | 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :400-403 Apr, 2019 |
| Relation: | 2019 International Conference on Electronics Packaging (ICEP) |
| Database: | IEEE Xplore Digital Library |