| Title: |
Where is the Sweet Spot for Panel Level Packaging? |
| Authors: |
Braun, T; Becker, K. -F.; Hoelck, O.; Voges, S.; Woehrmann, M.; Boettcher, L.; Toepper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K. -D. |
| Source: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :9-9 May, 2019 |
| Relation: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |