| Title: |
Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications |
| Authors: |
Fournel, F.; Sanchez, L.; Montmayeul, B.; Castan, C.; Laugier, M.; Bally, L.; Larrey, V.; Mauguen, G.; Cheramy, S.; Jouve, A.; Rolland, E.; Morales, C.; Szelag, B.; Hassan, K.; Adelimini, L.; Rieutord, F. |
| Source: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :16-16 May, 2019 |
| Relation: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |