| Title: |
Stacking 4” Si Wafer with Parallel 3-Stepped Micro-Trenches to Deposit Superconducting Material for Magnetic Energy Storage |
| Authors: |
Sasaki, M.; Suzuki, Y.; Hioki, T.; Motohiro, T. |
| Source: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :79-79 May, 2019 |
| Relation: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |