| Title: |
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node |
| Authors: |
Nogami, Takeshi; Huang, H.; Shobha, H.; Patlolla, R.; Kelly, J.; Penny, C.; Hu, C.-K.; Sil, D.; DeVries, S.; Lee, J.; Nguyen, S.; Jiang, L.; Demarest, J.; Li, J.; Lian, G.; Ali, M.; Bhosale, P.; Lanzillo, N.; Motoyama, K.; Lian, S.; Standaert, T.; Bonilla, G.; Edelstein, D.; Haran, B. |
| Source: |
2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T18-T19 Jun, 2019 |
| Relation: |
2019 Symposium on VLSI Technology |
| Database: |
IEEE Xplore Digital Library |