| Title: |
Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations |
| Authors: |
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Lin, Curry; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Lo, Penny; So, R.; Chen, Y. H.; Fan, Nelson; Kuah, Eric; Lin, Marc; Cheung, Y. M.; Ng, Eric; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Tao, Mian; Lo, Jeffery; Lee, Ricky |
| Source: |
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :14-20 May, 2019 |
| Relation: |
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |