| Title: |
Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations |
| Authors: |
Lau, John; Li, Ming; Xu, Iris; Chen, Tony; Tan, Kim Hwee; Li, Zhang; Fan, Nelson; Kuah, Eric; So, Raymond; Lo, Penny; Cheung, Y. M.; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Ko, Cheng-Ta; Yang, Henry; Chen, Y.H.; Tao, Mian; Lo, Jeffery; Lee, Ricky |
| Source: |
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :903-909 May, 2019 |
| Relation: |
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |