| Title: |
High Capacity Silicon Photonics Packaging |
| Authors: |
Binda, Marco; Canciamilla, Antonio; Daverio, Alessio; Fincato, Antonio; Gambini, Piero; Maggi, Luca; Orlandi, Piero; Ramini, Luca; Repossi, Matteo; Simbula, Angelica; Shaw, Mark |
| Source: |
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-8 Sep, 2019 |
| Relation: |
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |