Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules
| Title: | Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules |
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| Authors: | Chen, C.; Pickert, V.; Al-Greer, M.; Jia, C.; Ng, C. |
| Source: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 35(8):7804-7815 Aug, 2020 |
| Database: | IEEE Xplore Digital Library |