Panel Level Packaging - From Idea to Industrialization -
| Title: | Panel Level Packaging - From Idea to Industrialization - |
|---|---|
| Authors: | Braun, T.; Becker, K.-F.; Hoelck, O.; Voges, S.; Boettcher, L.; Topper, M.; Stobbe, L.; Aschenbrenner, R.; Voitel, M.; Schneider-Ramelow, M.; Lang, K.-D. |
| Source: | 2019 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2019 IEEE. :85-87 Nov, 2019 |
| Relation: | 2019 IEEE CPMT Symposium Japan (ICSJ) |
| Database: | IEEE Xplore Digital Library |