Solid-State Qubits: 3D Integration and Packaging
| Title: | Solid-State Qubits: 3D Integration and Packaging |
|---|---|
| Authors: | Rosenberg, D.; Weber, S.; Conway, D.; Yost, D.; Mallek, J.; Calusine, G.; Das, R.; Kim, D.; Schwartz, M.; Woods, W.; Yoder, J.; Oliver, W. |
| Source: | IEEE Microwave Magazine IEEE Microwave Microwave Magazine, IEEE. 21(8):72-85 Aug, 2020 |
| Database: | IEEE Xplore Digital Library |