| Title: |
High vacuum wafer level packaging for uncooled infrared sensor |
| Authors: |
Urquia, Mikel Azpeitia; Allegato, Giorgio; Paleari, Stefano; Tripodi, Francesco; Oggioni, Laura; Garavaglia, Matteo; Nemirovsky, Yael; Blank, Tanya |
| Source: |
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-5 Jun, 2020 |
| Relation: |
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) |
| Database: |
IEEE Xplore Digital Library |