| Title: |
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration |
| Authors: |
Jourdain, Anne; Schleicher, Filip; De Vos, Joeri; Stucchi, Michele; Chery, Emmanuel; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Walsby, Edward; Roberts, Kerry; Ashraf, Huma; Thomas, Dave; Beyne, Eric |
| Source: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :42-48 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |