| Title: |
Investigation of Thermo-mechanical and Phase-change Behavior in the Sn/Cu Interconnects during Self-Propagating Exothermic Reaction Bonding |
| Authors: |
Liang, Shuibao; Zhong, Yi; Robertson, Stuart; Liu, Allan; Zhou, Zhaoxia; Liu, Changqing |
| Source: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :269-275 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |