| Title: |
Compression Molding Mechanism and Parameter Evaluation of SiP |
| Authors: |
Lin, YiXuan; Hu, Ian; Chen, Dao-Long; Tarng, David; Hung, CP |
| Source: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :116-120 Oct, 2020 |
| Relation: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |