Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires
| Title: | Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires |
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| Authors: | Liu, Zaiyong; Chen, Hai-Bao; Hou, Tianshu |
| Source: | 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) Circuits and Systems (APCCAS), 2020 IEEE Asia Pacific Conference on. :62-65 Dec, 2020 |
| Relation: | 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) |
| Database: | IEEE Xplore Digital Library |