| Title: |
Fan-Out Wafer Level Packaging Development Line |
| Authors: |
TC, Chai; Ho, David; SC, Chong; HY, Hsiao; Soh, Serine; Lim, Simon; PS, Sharon Lim; Wai, Eva; BL, Lau; WW, Seit; GK, Lau; TS, Phua; Lim, Keith; SH, Sharon Lim; YL, Ye |
| Source: |
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :440-444 Dec, 2020 |
| Relation: |
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |